Manufacturing Process Development Engineer-Wafer Cleaving Operation
Lumentum · Usa - Nc- Greensboro, United States · full time · On site · August 27, 2026
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It's fun to work in a company where people truly BELIEVE in what they're doing!
We're committed to bringing passion and customer focus to the business.
If you like wild growth and working with happy, enthusiastic over-achievers, you'll enjoy your career with us!
We are seeking an experienced Process Engineer to lead processing of singulation and facet preparation on edge emitting laser components through the back end of line. This role will both sustain existing processes and develop processes for new technologies.
Required Qualifications:
- B.S. or M.S. in Materials Science, Mechanical Engineering, Electrical Engineering or related discipline
- 5+ years of industrial experience supporting semiconductor or advanced manufacturing processes
Preferred Experience & Skills:
- Experience in semiconductor wafer fabrication
- Experience with wafer die singulation
- Experience with pick and place equipment and die handling practices
- Familiarity with automation and advanced process control
- Proficiency with JMP, Excel, SQL, Python, or similar data tools
- Excellent written and verbal communication skills, including technical documentation
Salary Range:
The salary range for this position is $89,650 – $166,000USD. Final compensation will be determined based on factors such as experience, skills, and qualifications
We are an equal opportunity employer and value diversity at our company.
We do not discriminate on the basis of race, religion, color, national origin, sex, gender, gender expression, sexual orientation, age, marital status, veteran status, or disability status.
We will ensure that individuals with disabilities are provided reasonable accommodation to participate in the job application or interview process, to perform essential job functions, and to receive other benefits and privileges of employment.
Please contact us to request accommodation.
Wafer singulation:
- Process development for wafer cleaving operation
- Own and sustain processing of thinned wafers through the singulation and facet coating preparation
- Establish and maintain processes, specifications, SPC controls, FMEAs and OCAPs
Facet Processing:
- Develop and sustain pick and place processes and equipment
- Develop and sustain bar stacking/unstacking to and from fixtures for facet processing
Manufacturing Support & Yield Improvement:
- Provide real‑time engineering support for thinning operations in high‑volume manufacturing
- Lead response to process excursions, tool issues, and product at‑risk situations using structured problem‑solving methods
- Investigate yield losses, defects, and reliability issues and implement corrective and preventative actions
- Utilize SPC, DOE, and statistical analysis tools to identify root causes and improvement opportunities
- Employer
- Lumentum
- Location
- Usa - Nc- Greensboro, United States · On site
- Contract
- full time