TW_汽車電子封裝_Packaging Development Engineer (ASIC)

Bosch · Taipei, Taiwan · full-time · Hybrid · August 24, 2026

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Posted August 24, 2026 · Read from Bosch
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Job Description

We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset, and a passion for continuous learning.

In this role, you will define, develop, and qualify robust packaging solutions. Your core tasks include:

  • Package Design & Process Development: Drive design, material selection, and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams.
  • Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks.
  • OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control.
  • NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).
  • Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design, test, and quality management teams.

Language & Travel Requirements

  • Language Skills: Excellent English (verbal and written, min. C1 level) for international collaboration, paired with professional Mandarin Chinese for technical discussions with local teams and regional suppliers.
  • Travel: Flexibility to travel to overseas supplier sites and OSAT manufacturing facilities according to project needs.

Technical Experience & Capabilities

  • Education & Experience: Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related disciplines, with 3+ years of experience in semiconductor packaging engineering.
  • Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).
  • Problem-Solving Skills: Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D, statistic, etc…)
  • Supplier Management: Proven ability to steer collaboration with external suppliers
Employer
Bosch
Location
Taipei, Taiwan · Hybrid
Contract
full-time